Intel Bolt Lake “Center Ultra 200” & Puma Lake “Center Ultra 300” CPUs Break Cover

Intel Readies Bolt Lake and Puma Lake CPUs for PCs, Powering Next-Gen Center Ultra 200 and Center Ultra 300 Series

The customs and shipping logger, nbd.ltd, has exposed several next-gen Intel Bolt Lake “Center Ultra 200” and Puma Lake “Center Ultra 300” CPUs earmarked for PC platforms. The leaks also provide insights into the possible process nodes these chips will utilize.

Intel Bolt Lake Lineup

Starting with Intel’s Bolt Lake lineup, the Center Ultra 200 CPU family will scale across various PC platforms, including desktops and laptops. These chips will be available in four main segments:

• “S” for Desktops
• “HX” for High-End Laptops
• “H” for Performance Laptops
• “U” for Low-Power Designs

Although we’ve previously covered Intel’s Bolt Lake-S Desktop CPUs, this post will focus on the leaked laptop variants.

Bolt Lake-HX “Center Ultra 200” CPUs

For Intel’s high-end Bolt Lake-HX “Center Ultra 200” CPUs, the company is incorporating 8 P-Cores based on the Lion Bay architecture and 16 E-Cores based on the Skymont core architecture. These chips will closely resemble the desktop SKUs with similar die configurations as seen in previous HX series. The Bolt Lake-H CPUs will feature 14-core configs with up to 6 P-Cores and 8 E-Cores, similar to the current Raptor Lake-P/H SKUs.

Bolt Lake-U CPUs

The low-power Bolt Lake-U chips will feature a 10-core config with up to 2 P-Cores and 8 E-Cores.

Full Range of Leaked Chips:

• Bolt Lake-S 24-Core 8+16 (LGA 1851) – 3.6 GHz/36 MB L3 Cache
• Bolt Lake-S 14-Core 6+8 (LGA 1851) – 2.8 GHz/24 MB L3 Cache
• Bolt Lake-S 6-Core 6+0 (LGA 1851) – 2.8 GHz/18 MB L3 Cache
• Bolt Lake-HX 16-Core 8+8 (FCBGA) – 2.9 GHz/30 MB L3 Cache
• Bolt Lake-HX 14-Core 6+8 (FCBGA) – 3.0 GHz/24 MB L3 Cache
• Bolt Lake-H 14-Core 6+8 (FCBGA) – TBD
• Bolt Lake-U 10-Core 2+8 (FCBGA) – TBD

Graphics Architecture

The Bolt Lake-H CPUs will include GT2 tier graphics based on the Arc Alchemist Xe-LPG+ graphics architecture, while Bolt Lake-HX CPUs will retain the existing Arc Xe-LPG iGPU, similar to the desktop variants. The Bolt Lake-U CPUs will also feature the Arc Xe-LPG+ iGPU but only in GT1 configurations.

Process Node Details

Interestingly, the leak mentions the N3B process node for Bolt Lake-H, indicating Intel’s continued use of TSMC’s process node for its next high-end laptop chips. According to @miktdt, the compute tile will use the N3B process node, while the iGPU tile will be based on the N4 process node.

Intel Puma Lake Lineup

In addition to Bolt Lake, new shipping logs reveal Intel’s Puma Lake “Center Ultra 300” CPUs in UH, UPH, and P variants. These chips are currently under evaluation on reference platforms, with Intel recently achieving “Power On” with PTL parts on the 18A node.

Future Memory and Configuration Plans

Furthermore, Intel plans to incorporate LPDDR5X on-package memory with Puma Lake-U low-power SKUs for thin and light platforms. Intel has confirmed that its Puma Lake lineup will enhance what Lunar Lake offered, providing more flexible DRAM configurations, so users won’t be limited to just 16 GB or 32 GB LPDDR5X capacities. A more recent Puma Lake leak confirmed the “H” SKUs with 12 Xe cores based on the Celestial graphics IP.

Release Timeline

A Dell leak indicates that Intel Bolt Lake-H/P/U CPUs are targeting an early 2025 release, likely around CES 2025, while Puma Lake CPUs aim for a mid-2026 release.

Intel Mobility CPU Lineup: