M5 Pro Chip to Separate CPU and GPU in ‘Server-Grade’ Configuration

One of the standout features of Apple’s A-series and M-series chips has been their System-on-a-Chip (SoC) design, which combines all essential components—including the CPU and GPU—into a single, tightly integrated package. However, a recent report hints at a paradigm shift with the upcoming M5 Pro chip, suggesting a new approach where the CPU and GPU will be more distinct, potentially enhancing performance and improving production efficiency.

The Evolution of the System-on-a-Chip (SoC)

Historically, traditional computers and computer-like devices utilized separate components for the CPU (central processing unit) and GPU (graphical processing unit), often housed on entirely different circuit boards.

Apple’s introduction of the SoC design, starting with the iPhone, revolutionized this concept by integrating both CPU and GPU into a single unit. This innovative approach provided significant benefits, such as improved energy efficiency and better performance. Apple later extended this design philosophy to its M-series chips used in Apple Silicon Macs, creating compact packages with seamlessly integrated functionality.

Although some debate remains over whether these should be regarded as singular chips or tightly integrated assemblies of multiple chips, Apple continues to refer to its designs with unified terminology—for instance, the A18 Pro chip or the M4 chip.

M5 Pro Chip with Discrete CPU and GPU

Renowned Apple analyst Ming-Chi Kuo has revealed that the M5 Pro chip will leverage TSMC’s cutting-edge packaging process, referred to as SoIC-mH (System-on-Integrated-Chips-Molding-Horizontal).

This advanced process involves packaging separate chips in a way that significantly enhances thermal performance. By doing so, the chip can operate at peak power levels for extended periods before requiring throttling to manage heat. Additionally, SoIC-mH is expected to improve manufacturing yields, reducing the number of chips that fail quality checks.

Kuo’s report further notes that this method will not only apply to the M5 Pro but will also extend to the Max and Ultra variants of the M5 chip lineup.

Expanding Beyond Mobile: A Shift in Strategy

Interestingly, earlier reports indicated that Apple’s iPhone 18 might also adopt a more modular design for its A-series chips, potentially separating RAM, which has traditionally been integrated within the chip itself.

For the M5 Pro chip, the move towards discrete CPU and GPU configurations could mark a significant milestone in Apple’s chip design strategy, opening doors for better scalability and performance in diverse applications.

Powering Apple Intelligence Servers

Beyond consumer devices, the M5 Pro chip is also expected to find applications in Apple Intelligence servers—internally referred to as Private Cloud Compute (PCC). These servers rely heavily on high-performance chips to manage advanced AI workloads, and the M5 Pro’s enhanced design could position it as a cornerstone of Apple’s enterprise solutions.

By deploying the M5 Pro in server environments, Apple aims to capitalize on its technological advancements while further diversifying its product ecosystem.